A new leak tells us the specs of Xiaomi's indigenously developed smartphone SoC. It is manufactured on TSMC's N4P node and is said to debut later this year.
There have been several murmurs about Xiaomi developing an in-house smartphone SoC after its first attempt at the endeavour fell flat. But, as is the case with most unreleased hardware, there is a ton of conflicting information floating about. One rumour says the mystery chip has taped out on TSMC's N3 class node, while another says it will use TSMC N4P.
Information sourced by trusted leaker Jukanlosreve says it is the latter, and even tells us its CPU layout. Apparently, it will feature one Cortex-X925 prime core, clocked at 3.2 GHz, three Cortex-A725 cores at 2.6 GHz and for Cortex-A520 cores at 2.0 GHz. While this layout doesn't exactly scream high-end, it is alright for what is essentially Xiaomi's first Arm v9 chip.
This chip is tipped to debut sometime in 2025. The prospects of it powering a high-end smartphone are dim, but there's a good chance it could debut alongside a mid-ranger likes the Xiaomi 15S. N4P makes more sense because it is a mature node, hence making it easier for Xiaomi to get fab space. Plus, N4P wafers should be a cheaper than cutting-edge N3E ones.
Lastly, it will use an Imagination Technologies IMG DXT-72 GPU clocked 1.3 GHz. The company has its own ISP, but there are a ton of other variables at play, such as, DSP, 5G modem, etc. Those will likely be off-the-shelf parts from the likes of, MediaTek, Synopsys, etc. But, there's a non-zero chance of Xiaomi sourcing them locally from the likes of Huawei.